ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,625, issued on Sept. 15, was assigned to Huawei Technologies'Co.'Ltd.' (Shenzhen, China). "Coupler and electronic device" was invented by ... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,626, issued on Sept. 15. "Data aggregation and compute module" was invented by Walter Mark Hendrix (Richardson, Texas) and Mark James Smrh... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,627, issued on Sept. 15, was assigned to Chiun Mai Communication Systems Inc. (New Taipei, Taiwan). "Heat dissipation module and antenna a... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,628, issued on Sept. 15, was assigned to 3M Innovative Properties Co. (St. Paul, Minn.). "Passive radiative cooling film for antennas" was... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,629, issued on Sept. 15, was assigned to California Institute of Technology (Pasadena, Calif.). "Kinematic hinge with asymmetric pin hole"... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,630, issued on Sept. 15, was assigned to City University of Hong Kong (Kowloon, Hong Kong). "Painting antenna and antenna-integrated artic... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,631, issued on Sept. 15, was assigned to Snap Inc. (Santa Monica, Calif.). "Hybrid antenna system for wearable devices" was invented by Ma... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,632, issued on Sept. 15, was assigned to Wistron NeWeb Corp. (Hsinchu, Taiwan). "Electronic device and antenna structure" was invented by ... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,633, issued on Sept. 15, was assigned to Wistron NeWeb Corp. (Hsinchu, Taiwan). "Electronic device and antenna module" was invented by Chu... Read More
ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,634, issued on Sept. 15, was assigned to NXP USA INC. (Austin, Texas). "Package on package semiconductor device with integrated antenna an... Read More