US Patent Issued to Chiun Mai Communication Systems on Sept. 15 for "Heat dissipation module and antenna array device having same" (Taiwanese Inventors)

ALEXANDRIA, Va., Sept. 15 -- United States Patent no. 12,738,627, issued on Sept. 15, was assigned to Chiun Mai Communication Systems Inc. (New Taipei, Taiwan).

"Heat dissipation module and antenna array device having same" was invented by Chun-Chih Chen (New Taipei, Taiwan), Kuang-Chen Wu (New Taipei, Taiwan), Ke-Xuan Luo (New Taipei, Taiwan) and Po-Ching Huang (New Taipei, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A heat dissipation module and an antenna array device applying the heat dissipation module are provided, the antenna array device includes an upper cover and a circuit board, the heat dissipation module includes a body; a plurality of heat-conducting structures arranged in an array on...