ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,854, issued on March 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor packages having semic... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,112, issued on March 3, was assigned to ABB E-Mobility B.V. (Delft, Netherlands). "Electric vehicle charging connector with external passiv... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,113, issued on March 3, was assigned to Bayerische Motoren Werke AG (Munich). "Method for detecting a manipulation of a message of a bus sy... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,567,885, issued on March 3, was assigned to Boost SubscriberCo LLC (Englewood, Colo.). "Accessory device for satellite communications" was inve... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,351, issued on March 3, was assigned to WestRock Shared Services LLC (Atlanta). "Convertible wrap around container" was invented by David G... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,324, issued on March 3, was assigned to TOSHIBA TEC K.K. (Tokyo). "Image processing apparatus and image processing system for abnormality d... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,691, issued on March 3, was assigned to CAPITAL ONE SERVICES LLC (Mclean, Va.). "Systems and methods for testing application resiliency" wa... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,236, issued on March 3, was assigned to ResMed Pty Ltd (Bella Vista, Australia). "Positioning and stabilising structure and system incorpor... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,851, issued on March 3, was assigned to Guala Dispensing S.P.A. (Alessandria, Italy). "Trigger-type dispensing head for a dispensing device... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,823, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package structure" was inve... Read More