US Patent Issued to Taiwan Semiconductor Manufacturing on March 3 for "Semiconductor packages having semiconductor blocks surrounding semiconductor device" (Taiwanese Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,854, issued on March 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor packages having semiconductor blocks surrounding semiconductor device" was invented by Kai-Fung Chang (Taipei City, Taiwan), Sheng-Feng Weng (Taichung City, Taiwan), Ming-Yu Yen (MiaoLi County, Taiwan), Chih-Wei Lin (Hsinchu County, Taiwan) and Ching-Hua Hsieh (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package includes a first substrate and a first semiconductor device. The first semiconductor device is bonded to the first substrate and includes a second substrate, a plurality of first dies and a ...