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US Patent Issued to xLight on Sept. 8 for "Light source system and method of operation" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,087, issued on Sept. 8, was assigned to xLight Inc. (Palo Alto, Calif.). "Light source system and method of operation" was invented by Geor... Read More


US Patent Issued to The Board of Regents of the University of Oklahoma on Sept. 8 for "Non-thermal hybrid-plasma and methods of production and use thereof" (Oklahoma Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,088, issued on Sept. 8, was assigned to The Board of Regents of the University of Oklahoma (Norman, Okla.). "Non-thermal hybrid-plasma and ... Read More


US Patent Issued to Intel on Sept. 8 for "PCB fabrication with EMI film on multi-layer rigid PCB" (Indian Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,089, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "PCB fabrication with EMI film on multi-layer rigid PCB" was inv... Read More


US Patent Issued to Credo Technology Group on Sept. 8 for "Bridge coupling to surface emitters" (California Inventor)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,090, issued on Sept. 8, was assigned to Credo Technology Group Ltd (Cayman Islands). "Bridge coupling to surface emitters" was invented by ... Read More


US Patent Issued to Korea Photonics Technology Institute on Sept. 8 for "Stretchable substrate, and method for manufacturing stretchable substrate" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,091, issued on Sept. 8, was assigned to Korea Photonics Technology Institute (Gwangju, South Korea). "Stretchable substrate, and method for... Read More


US Patent Issued to Dai Nippon Printing on Sept. 8 for "Wiring board" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,092, issued on Sept. 8, was assigned to Dai Nippon Printing Co. Ltd. (Tokyo). "Wiring board" was invented by Hiroki Furushou (Tokyo), Atsuk... Read More


US Patent Issued to ADVANCED CHIP AND CIRCUIT MATERIALS on Sept. 8 for "Use of inorganic thin non-woven dielectrics in printed circuit boards" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,093, issued on Sept. 8, was assigned to ADVANCED CHIP AND CIRCUIT MATERIALS INC. (San Jose, Calif.). "Use of inorganic thin non-woven diele... Read More


US Patent Issued to SAMSUNG ELECTRO-MECHANICS on Sept. 8 for "Printed circuit board" (South Korean Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,094, issued on Sept. 8, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by... Read More


US Patent Issued to QUALCOMM on Sept. 8 for "Package comprising a substrate with an interconnect block" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,095, issued on Sept. 8, was assigned to QUALCOMM Inc. (San Diego). "Package comprising a substrate with an interconnect block" was invented... Read More


US Patent Issued to MEKTEC on Sept. 8 for "Flexible printed board and flexible printed board connection structure" (Japanese Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,096, issued on Sept. 8, was assigned to MEKTEC Corp. (Tokyo). "Flexible printed board and flexible printed board connection structure" was ... Read More