US Patent Issued to QUALCOMM on Sept. 8 for "Package comprising a substrate with an interconnect block" (California Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,095, issued on Sept. 8, was assigned to QUALCOMM Inc. (San Diego).

"Package comprising a substrate with an interconnect block" was invented by Hong Bok We (San Diego), Joan Rey Villarba Buot (Escondido, Calif.), Sang-Jae Lee (San Diego) and Zhijie Wang (San Diego).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate comprising a core layer, at least one first dielectric layer coupled to a first surface of the core layer, at least one second dielectric layer coupled to a second surface of the core layer, a plurality of interconnects located at least partially in the at least one first dielectric layer; a region comprising a plurality of block in...