ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,548, issued on Sept. 8, was assigned to SILICONWARE PRECISION INDUSTRIES Co. LTD. (Taichung City, Taiwan). "Electronic package and fabricat... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,549, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Ky... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,550, issued on Sept. 8, was assigned to AUDI AG (Ingolstadt, Germany). "Power electronics arrangement with parallel connected semiconductor... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,551, issued on Sept. 8, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Apparatus for manufacturing display device and ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,552, issued on Sept. 8, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device, method of manufacturing the sam... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,553, issued on Sept. 8, was assigned to Samsung Display Co. Ltd. (Yongin-Si, South Korea). "Light emitting display device, and car having l... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,554, issued on Sept. 8, was assigned to LG Display Co. Ltd. (Seoul, South Korea). "Light emitting display device" was invented by Joonsuk L... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,555, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by Hy... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,556, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Offset interposers for large-bottom packages and large-die pack... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,557, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and method of ... Read More