US Patent Issued to Intel on Sept. 8 for "Offset interposers for large-bottom packages and large-die package-on-package structures" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,556, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"Offset interposers for large-bottom packages and large-die package-on-package structures" was invented by Russell K. Mortensen (Chandler, Ariz.), Robert M. Nickerson (Chandler, Ariz.) and Nicholas R. Watts (Phoenix).

According to the abstract* released by the U.S. Patent & Trademark Office: "An offset interposer includes a land side including land-side ball-grid array (BGA) and a package-on-package (POP) side including a POP-side BGA. The land-side BGA includes two adjacent, spaced-apart land-side pads, and the POP-side BGA includes two adjacent, spaced-apart POP-side pads that are coupled to the respecti...