ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,508, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device including alignment key... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,509, issued on Sept. 8, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Alignment mark via assemblies for a... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,510, issued on Sept. 8, was assigned to SK hynix Inc. (Icheon-si, South Korea). "Semiconductor device and method of manufacturing semicondu... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,511, issued on Sept. 8, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Method for manufacturing semiconductor apparatus and semiconductor a... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,512, issued on Sept. 8, was assigned to Allegro MicroSystem LLC (Manchester, N.H.). "Packaged current sensor integrated circuit" was invent... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,513, issued on Sept. 8, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Jump-fusing and tailored PCB system for loop inductance reduction... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,514, issued on Sept. 8, was assigned to Mitsubishi Electric Corp. (Tokyo). "Semiconductor device and method of manufacturing semiconductor ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,515, issued on Sept. 8, was assigned to STMicroelectronics S.r.l. (Agrate Brianza, Italy). "Method of manufacturing semiconductor devices a... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,516, issued on Sept. 8, was assigned to STMICROELECTRONICS PTE LTD (Singapore). "Semiconductor package with exposed electrical contacts" wa... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,517, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "Packaging architecture with patterned through-dielectric vias a... Read More