ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,511, issued on Sept. 8, was assigned to ROHM Co. LTD. (Kyoto, Japan).

"Method for manufacturing semiconductor apparatus and semiconductor apparatus" was invented by Koshun Saito (Kyoto, Japan), Kota Ise (Kyoto, Japan) and Kosuke Yamada (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor device manufacturing method includes a first preparation step, a second preparation step, a mounting step, a third preparation step, a placing step and a curing step. In the first preparation step, a first leadframe including an island part is prepared. In the second preparation step, a semiconductor element including an element obverse surfa...