ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,294, issued on Sept. 8, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Micro semiconductor chip transfer method and... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,295, issued on Sept. 8, was assigned to Japan Display Inc. (Tokyo). "Manufacturing method of display device using deformable spacers" was i... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,296, issued on Sept. 8, was assigned to ANHUI SANAN OPTOELECTRONICS Co. LTD. (Wuhu, China). "Light-emitting device and light-emitting appar... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,297, issued on Sept. 8, was assigned to LG DISPLAY Co. LTD. (Seoul, South Korea). "Display device having step compensation layers in areas ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,298, issued on Sept. 8, was assigned to Sharp Display Technology Corp. (Kameyama City, Japan). "Display device" was invented by Shinichi Ha... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,299, issued on Sept. 8, was assigned to Japan Display Inc. (Tokyo). "Display device and light emitting diode chip" was invented by Kenichi ... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,300, issued on Sept. 8, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Light emitting element and display device inclu... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,301, issued on Sept. 8, was assigned to XIAMEN SAN'AN OPTOELECTRONICS Co. LTD. (Xiamen, China). "Light-emitting diode and method for manufa... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,302, issued on Sept. 8, was assigned to PLAYNITRIDE DISPLAY Co. LTD. (Zhunan Township Miaoli County, Taiwan). "Micro light-emitting element... Read More
ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,303, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.). "IC package with micro LEDs" was invented by Jacob Vehonsky (Gil... Read More