US Patent Issued to Intel on Sept. 8 for "IC package with micro LEDs" (Arizona Inventors)

ALEXANDRIA, Va., Sept. 8 -- United States Patent no. 12,733,303, issued on Sept. 8, was assigned to Intel Corp. (Santa Clara, Calif.).

"IC package with micro LEDs" was invented by Jacob Vehonsky (Gilbert, Ariz.), Onur Ozkan (Scottsdale, Ariz.), Vinith Bejugam (Chandler, Ariz.), Mao-Feng Tseng (Tempe, Ariz.), Nicholas Haehn (Scottsdale, Ariz.), Andrea Nicolas Flores (Chandler, Ariz.), Ali Lehaf (Phoenix), Benjamin Duong (Phoenix) and Joshua Stacey (Chandler, Ariz.).

According to the abstract* released by the U.S. Patent & Trademark Office: "Embodiments of an integrated circuit (IC) package are disclosed. In some embodiments, the IC package includes a semiconductor die, a glass substrate, and a package substrate. The semiconductor die inclu...