International Patent: COMPOSITIONS AND METHODS RELATED TO TUMOR ACTIVATED MOLECULES TARGETING NECTIN-4 AND EFFECTOR CELL ANTIGENS

GENEVA, July 2 -- MERCK SHARP & DOHME LLC filed a patent application (US2025/059563) for “COMPOSITIONS AND METHODS RELATED TO TUMOR ACTIVATED MOLECULES TARGETING NECTIN-4 AND EFFECTOR CELL ANTIGENS”. ... Read More

International Patent: PREPARATION OF OXALAMIDE DERIVATIVES AS NOVEL DIACYLGLYCERIDE O-ACYLTRANSFERASE 2 INHIBITORS

GENEVA, July 2 -- MERCK SHARP & DOHME LLC filed a patent application (US2025/059566) for “PREPARATION OF OXALAMIDE DERIVATIVES AS NOVEL DIACYLGLYCERIDE O-ACYLTRANSFERASE 2 INHIBITORS”. With publicatio... Read More

International Patent: FAST AND SECURE MEMORY ADDRESS TRANSLATION IN A VIRTUAL MACHINE COMPUTING SYSTEM

GENEVA, July 2 -- NVIDIA CORPORATION filed a patent application (US2025/059538) for “FAST AND SECURE MEMORY ADDRESS TRANSLATION IN A VIRTUAL MACHINE COMPUTING SYSTEM”. With publication no. WO/2026/136... Read More

International Patent: THREE-DIMENSIONAL HETEROGENEOUS INTEGRATION MEMORY STACKS WITH REDUCED HYBRID BOND PAD, THROUGH-SILICON VIA, AND PACKAGE-LEVEL BOND PAD PITCHES

GENEVA, July 2 -- MICRON TECHNOLOGY, INC. filed a patent application (US2025/059541) for “THREE-DIMENSIONAL HETEROGENEOUS INTEGRATION MEMORY STACKS WITH REDUCED HYBRID BOND PAD, THROUGH-SILICON VIA, A... Read More

International Patent: MULTIPLEXED STACK IDENTIFIERS FOR MULTI-DIE STACKED MEMORY

GENEVA, July 2 -- RAMBUS INC. filed a patent application (US2025/059551) for “MULTIPLEXED STACK IDENTIFIERS FOR MULTI-DIE STACKED MEMORY”. With publication no. WO/2026/136184, here are the other detai... Read More

International Patent: METHOD FOR TREATING NEGATIVE SYMPTOMS OF SCHIZOPHRENIA

GENEVA, July 2 -- REVIVA PHARMACEUTICALS, INC. filed a patent application (US2025/059527) for “METHOD FOR TREATING NEGATIVE SYMPTOMS OF SCHIZOPHRENIA”. With publication no. WO/2026/136179, here are th... Read More

International Patent: SEMICONDUCTOR DEVICE ASSEMBLIES WITH ALUMINUM NITRIDE HYBRID BONDS AND METHODS OF FORMING THE SAME

GENEVA, July 2 -- MICRON TECHNOLOGY, INC. filed a patent application (US2025/059528) for “SEMICONDUCTOR DEVICE ASSEMBLIES WITH ALUMINUM NITRIDE HYBRID BONDS AND METHODS OF FORMING THE SAME”. With publ... Read More

International Patent: DEVICE PACKAGE

GENEVA, July 2 -- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC. filed a patent application (US2025/059531) for “DEVICE PACKAGE”. With publication no. WO/2026/136181, here are the other details related... Read More

International Patent: MEMORY DEVICE WITH MULTI-CONNECTION MECHANISM FOR COMBINATION PACKAGES

GENEVA, July 2 -- MICRON TECHNOLOGY, INC. filed a patent application (US2025/059501) for “MEMORY DEVICE WITH MULTI-CONNECTION MECHANISM FOR COMBINATION PACKAGES”. With publication no. WO/2026/136176, ... Read More

International Patent: SEMICONDUCTOR DEVICE ASSEMBLIES WITH BOND LINES INCLUDING ALUMINUM NITRIDE GAP FILL MATERIAL AND METHODS OF FORMING THE SAME

GENEVA, July 2 -- MICRON TECHNOLOGY, INC. filed a patent application (US2025/059509) for “SEMICONDUCTOR DEVICE ASSEMBLIES WITH BOND LINES INCLUDING ALUMINUM NITRIDE GAP FILL MATERIAL AND METHODS OF FO... Read More

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