International Patent: THREE-DIMENSIONAL HETEROGENEOUS INTEGRATION MEMORY STACKS WITH REDUCED HYBRID BOND PAD, THROUGH-SILICON VIA, AND PACKAGE-LEVEL BOND PAD PITCHES

GENEVA, July 2 -- MICRON TECHNOLOGY, INC. filed a patent application (US2025/059541) for “THREE-DIMENSIONAL HETEROGENEOUS INTEGRATION MEMORY STACKS WITH REDUCED HYBRID BOND PAD, THROUGH-SILICON VIA, AND PACKAGE-LEVEL BOND PAD PITCHES”. With publication no. WO/2026/136183, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G11C 5/04

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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