US Patent Issued to Intel on April 14 for "Capacitor pads and methods of manufacturing the same" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,748, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Capacitor pads and methods of manufacturing the same" was inv... Read More

US Patent Issued to Intel on April 14 for "Capacitor pads and methods of manufacturing the same" (Arizona Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,748, issued on April 14, was assigned to Intel Corp. (Santa Clara, Calif.). "Capacitor pads and methods of manufacturing the same" was inv... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,749, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Kyu... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package" (South Korean Inventor)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,749, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package" was invented by Kyu... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,751, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on April 14 for "Semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,751, issued on April 14, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Semiconductor package" was invented by ... Read More

US Patent Issued to Infineon Technologies Austria on April 14 for "Semiconductor die package" (German Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,752, issued on April 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor die package" was invented by ... Read More

US Patent Issued to Infineon Technologies Austria on April 14 for "Semiconductor die package" (German Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,752, issued on April 14, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor die package" was invented by ... Read More

US Patent Issued to Hyundai Mobis on April 14 for "Metal clip applied to power module" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,753, issued on April 14, was assigned to Hyundai Mobis Co. Ltd. (Seoul, South Korea). "Metal clip applied to power module" was invented by... Read More

US Patent Issued to Hyundai Mobis on April 14 for "Metal clip applied to power module" (South Korean Inventors)

ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,753, issued on April 14, was assigned to Hyundai Mobis Co. Ltd. (Seoul, South Korea). "Metal clip applied to power module" was invented by... Read More

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