ALEXANDRIA, Va., April 15 -- United States Patent no. 12,604,752, issued on April 14, was assigned to Infineon Technologies Austria AG (Villach, Austria).
"Semiconductor die package" was invented by Edward Furgut (Dasing, Germany), Irmgard Escher-Poeppel (Duggendorf, Germany), Martin Gruber (Schwandorf, Germany), Ivan Nikitin (Regensburg, Germany) and Hans-Joachim Schulze (Taufkirchen, Germany).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor die package includes a semiconductor transistor die having a contact pad on an upper main face. The semiconductor die package also includes an electrical conductor disposed on the contact pad and fabricated by laser-assisted structuring of a metallic materi...