US Patent Issued to SAMSUNG DISPLAY on Feb. 24 for "Display device" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,919, issued on Feb. 24, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea). "Display device" was invented by Bon Yong Koo ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on Feb. 24 for "Hybrid decoupling capacitor and method forming same" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,754, issued on Feb. 24, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Hybrid decoupling capacitor and met... Read More

US Patent Issued to ROKU on Feb. 24 for "Utilizing a single buffer for a dynamic number of players, each using a dynamically sized buffer" (California Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,242, issued on Feb. 24, was assigned to ROKU INC. (San Jose, Calif.). "Utilizing a single buffer for a dynamic number of players, each usin... Read More

US Patent Issued to AIQ Global on Feb. 24 for "Methods and systems for assessing treatment of a disease based on lesion features" (Wisconsin Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,562,258, issued on Feb. 24, was assigned to AIQ Global Inc. (Madison, Wis.). "Methods and systems for assessing treatment of a disease based on... Read More

US Patent Issued to Trend Micro on Feb. 24 for "Locating a server in a computer network" (Taiwanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,013, issued on Feb. 24, was assigned to Trend Micro Inc. (Tokyo). "Locating a server in a computer network" was invented by Hungshen Wu (Ta... Read More

US Patent Issued to BOE TECHNOLOGY GROUP on Feb. 24 for "Display substrate" (Chinese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,940, issued on Feb. 24, was assigned to BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Display substrate" was invented by Lujiang Huangfu (Beiji... Read More

US Patent Issued to LINTEC on Feb. 24 for "High-frequency dielectric heating adhesive sheet, joining method, and joined body" (Japanese Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,559,654, issued on Feb. 24, was assigned to LINTEC Corp. (Tokyo). "High-frequency dielectric heating adhesive sheet, joining method, and joined... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Feb. 24 for "Integrated circuit device" (South Korean Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,563,719, issued on Feb. 24, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Gyeonggi-do, South Korea). "Integrated circuit device" was invented b... Read More

US Patent Issued to Mercedes-Benz Group on Feb. 24 for "Method and computing system for travelway feature detection and reporting" (California Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,561,953, issued on Feb. 24, was assigned to Mercedes-Benz Group AG (Stuttgart, Germany). "Method and computing system for travelway feature det... Read More

US Patent Issued to Kerr Machine on Feb. 24 for "Packing seal assembly" (Oklahoma Inventors)

ALEXANDRIA, Va., Feb. 24 -- United States Patent no. 12,560,156, issued on Feb. 24, was assigned to Kerr Machine Co. (Sulphur, Okla.). "Packing seal assembly" was invented by Christopher Todd Barnett... Read More

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