ALEXANDRIA, Va., March 3 -- United States Patent no. 12,564,315, issued on March 3, was assigned to AMBU A/S (Ballerup, Denmark). "Sliding motion transfer member for an endoscope" was invented by Jes... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. D1,115,534, issued on March 3, was assigned to ZED HOLDINGS HONG KONG Ltd. (North Point, Hong Kong). "Confectionery product container" was invente... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. D1,115,429, issued on March 3, was assigned to Jiangmen Eureka Decoration Material Co. LTD (Jiangmen, China). "Oven" was invented by Zhendong Zou ... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. D1,115,294, issued on March 3, was assigned to NIKE Inc. (Beaverton, Ore.). "Shoe" was invented by Joel Ryp Greenspan (Portland, Ore.). The paten... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,567,422, issued on March 3, was assigned to AAC Acoustic Technologies (Shanghai) Co. Ltd. (Shanghai). "Method and apparatus for encoding a mult... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,567,982, issued on March 3, was assigned to ASSA ABLOY AB (Stockholm). "Remote access via system-level trusted authorities" was invented by Pas... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,150, issued on March 3, was assigned to Mettler-Toledo GmbH (Greifensee, Switzerland). "Sensor and device for a sensor comprising gel elect... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,565,527, issued on March 3, was assigned to Attovia Therapeutics Inc. (San Carlos, Calif.). "IL13 and IL31 bispecific polypeptides and uses the... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,566,210, issued on March 3, was assigned to HAMILTON SUNDSTRAND Corp. (Charlotte, N.C.). "System and method for testing an integrity of a face ... Read More
ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,825, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of manufact... Read More