US Patent Issued to SAMSUNG ELECTRONICS on March 3 for "Semiconductor package and method of manufacturing semiconductor package" (South Korean Inventors)

ALEXANDRIA, Va., March 3 -- United States Patent no. 12,568,825, issued on March 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Semiconductor package and method of manufacturing semiconductor package" was invented by Yongjin Seol (Suwon-si, South Korea), Jungeun Koo (Suwon-si, South Korea), Tongsuk Kim (Suwon-si, South Korea), Youngjun Yoon (Suwon-si, South Korea), Mijeong Jeong (Suwon-si, South Korea) and Younghun Jung (Suwon-si, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "Provided is a semiconductor package including a redistribution structure including first surface and a second surface opposite to each other, the redistribution structure including a redistributio...