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INTERNATIONAL PATENT: AGC INC., AGC株式会社 FILES APPLICATION FOR "LAYERED SUBSTRATE, WIRING BOARD, METHOD FOR MANUFACTURING LAYERED SUBSTRATE, METHOD FOR MANUFACTURING WIRING BOARD AND SEMICONDUCTOR PACKAGE"

GENEVA, April 7 -- AGC INC. (5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008405), AGC株式会社 (東京都千代田区&#200... Read More


INTERNATIONAL PATENT: DAI NIPPON PRINTING CO., LTD., 大日本印刷株式会社 FILES APPLICATION FOR "POLYMERIZABLE LIQUID CRYSTAL COMPOUND, METHOD FOR PRODUCING SAME, POLYMERIZABLE COMPOSITION, POLYMER, RETARDATION FILM, METHOD FOR PRODUCING SAME, TRANSFER LAMINATE, OPTICAL MEMBER, METHOD FOR PRODUCING SAME AND DISPLAY DEVICE"

GENEVA, April 7 -- DAI NIPPON PRINTING CO., LTD. (1-1, Ichigaya-kagacho 1-chome, Shinjuku-ku, Tokyo1628001), 大日本印刷株式会社 (東京&... Read More


INTERNATIONAL PATENT: DAIKIN INDUSTRIES, LTD., ダイキン工業株式会社 FILES APPLICATION FOR "ELECTRONIC DEVICE"

GENEVA, April 7 -- DAIKIN INDUSTRIES, LTD. (Osaka Umeda Twin Towers South, 1-13-1, Umeda, Kita-ku, Osaka-shi, Osaka5300001), ダイキン工業株式会&#3... Read More


INTERNATIONAL PATENT: MICRO TECHNOLOGY CO.,LTD., 株式会社ミクロ技術研究所 FILES APPLICATION FOR "GLASS WIRING BOARD MANUFACTURING METHOD"

GENEVA, April 7 -- MICRO TECHNOLOGY CO.,LTD. (1-33-14 Tomigaya, Shibuya-ku, Tokyo1510063), 株式会社ミクロ技術研究所 (東&#2... Read More


INTERNATIONAL PATENT: MICRO SYSTEM CO., LTD., 有限会社マイクロシステム, KYOTO BOEKI CO., LTD., 京都貿易株式会社 FILES APPLICATION FOR "X-RAY SEMICONDUCTOR DETECTOR AND METHOD FOR PRODUCING SAME"

GENEVA, April 7 -- MICRO SYSTEM CO., LTD. (622-2, Okagami, Aso-ku, Kawasaki-shi, Kanagawa2150027), 有限会社マイクロシステム (&#3... Read More


INTERNATIONAL PATENT: DAIKIN INDUSTRIES, LTD., ダイキン工業株式会社 FILES APPLICATION FOR "ROTARY COMPRESSOR AND REFRIGERATION CYCLE DEVICE"

GENEVA, April 7 -- DAIKIN INDUSTRIES, LTD. (Osaka Umeda Twin Towers South, 1-13-1, Umeda, Kita-ku, Osaka-shi, Osaka5300001), ダイキン工業株式会&#3... Read More


INTERNATIONAL PATENT: DAIKIN INDUSTRIES, LTD., ダイキン工業株式会社 FILES APPLICATION FOR "CONTROL DEVICE"

GENEVA, April 7 -- DAIKIN INDUSTRIES, LTD. (Osaka Umeda Twin Towers South, 1-13-1, Umeda, Kita-ku, Osaka-shi, Osaka5300001), ダイキン工業株式会&#3... Read More


INTERNATIONAL PATENT: SHIBAURA MECHATRONICS CORPORATION, 芝浦メカトロニクス株式会社 FILES APPLICATION FOR "STICKING DEVICE AND ELECTRONIC COMPONENT MOUNTING DEVICE"

GENEVA, April 7 -- SHIBAURA MECHATRONICS CORPORATION (5-1, Kasama 2-chome, Sakae-ku, Yokohama-shi, Kanagawa2478610), 芝浦メカトロニクス株&#2... Read More


INTERNATIONAL PATENT: TOKYO ELECTRON LIMITED, 東京エレクトロン株式会社 FILES APPLICATION FOR "COMPUTER PROGRAM, INFORMATION PROCESSING METHOD AND INFORMATION PROCESSING DEVICE"

GENEVA, April 7 -- TOKYO ELECTRON LIMITED (3-1, Akasaka 5-chome, Minato-ku, Tokyo1076325), 東京エレクトロン株式会社 (東&#2... Read More


INTERNATIONAL PATENT: FUJIFILM CORPORATION, 富士フイルム株式会社 FILES APPLICATION FOR "RESIN COMPOSITION, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING CURED PRODUCT, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE, RESIN AND COMPOUND"

GENEVA, April 7 -- FUJIFILM CORPORATION (26-30, Nishiazabu 2-chome, Minato-ku, Tokyo1068620), 富士フイルム株式会社 (東京都... Read More