GENEVA, April 7 -- AGC INC. (5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008405), ＡＧＣ株式会社 (東京都千代田区丸の内一丁目５番１号) filed a patent application (PCT/JP2025/033448) for "LAYERED SUBSTRATE, WIRING BOARD, METHOD FOR MANUFACTURING LAYERED SUBSTRATE, METHOD FOR MANUFACTURING WIRING BOARD, AND SEMICONDUCTOR PACKAGE" on Sep 24, 2025. With publication no. WO/2026/070798, the details related to the patent application was published on Apr 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectu...