ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,744, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated circuit interconnect structures including copper-free ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,745, issued on Nov. 3, was assigned to CISCO TECHNOLOGY INC. (San Jose, Calif.). "Via ground structures" was invented by Wenbin Ma (Shanghai... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,746, issued on Nov. 3, was assigned to SOCIONEXT INC. (Kanagawa, Japan). "Semiconductor device" was invented by Wenzhen Wang (Yokohama, Japa... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,747, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Inline circuit edit" was invented by Clifford J. Engel (Hillsboro... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,748, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated ring structures" was invented by June Choi (Portland, ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,749, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices and methods of ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,750, issued on Nov. 3, was assigned to Northrop Grumman Systems Corp. (Falls Church, Va.). "Meshed transmission line" was invented by Nyle L... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,751, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "On package interconnect architecture for high-speed memory" was i... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,752, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device structure with energy removab... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,753, issued on Nov. 3, was assigned to Nexperia Technology (Shanghai) Ltd. (Shanghai) and NEXPERIA B.V. (Nijmegen, Netherlands). "Semiconduc... Read More