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US Patent Issued to Intel on Nov. 3 for "Integrated ring structures" (Oregon Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,748, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "Integrated ring structures" was invented by June Choi (Portland, ... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Nov. 3 for "Semiconductor devices and methods of manufacturing thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,749, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor devices and methods of ... Read More


US Patent Issued to Northrop Grumman Systems on Nov. 3 for "Meshed transmission line" (Maryland Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,750, issued on Nov. 3, was assigned to Northrop Grumman Systems Corp. (Falls Church, Va.). "Meshed transmission line" was invented by Nyle L... Read More


US Patent Issued to Intel on Nov. 3 for "On package interconnect architecture for high-speed memory" (Malaysian, American, Indian Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,751, issued on Nov. 3, was assigned to Intel Corp. (Santa Clara, Calif.). "On package interconnect architecture for high-speed memory" was i... Read More


US Patent Issued to NANYA TECHNOLOGY on Nov. 3 for "Semiconductor device structure with energy removable structure and method for preparing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,752, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device structure with energy removab... Read More


US Patent Issued to Nexperia Technology (Shanghai), NEXPERIA on Nov. 3 for "Semiconductor device" (Chinese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,753, issued on Nov. 3, was assigned to Nexperia Technology (Shanghai) Ltd. (Shanghai) and NEXPERIA B.V. (Nijmegen, Netherlands). "Semiconduc... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor device" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,754, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Jun Sung... Read More


US Patent Issued to SAMSUNG ELECTRONICS on Nov. 3 for "Semiconductor devices having connecting conductive lines" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,755, issued on Nov. 3, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices having connecting conduc... Read More


US Patent Issued to Micron Technology on Nov. 3 for "Memory devices including slot structures" (Idaho Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,756, issued on Nov. 3, was assigned to Micron Technology Inc. (Boise, Idaho). "Memory devices including slot structures" was invented by Ada... Read More


US Patent Issued to NANYA TECHNOLOGY on Nov. 3 for "Semiconductor device having at least one air gap and method for manufacturing the same" (Taiwanese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,757, issued on Nov. 3, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device having at least one air gap a... Read More