US Patent Issued to BEIJING BOE DISPLAY TECHNOLOGY, BOE TECHNOLOGY GROUP on Aug. 11 for "Display panel, method of manufacturing the same and display device" (Chinese Inventors)

Posted On: 2026-08-12

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,739, issued on Aug. 11, was assigned to BEIJING BOE DISPLAY TECHNOLOGY Co. LTD. (Beijing) and BOE TECHNOLOGY GROUP Co. LTD. (Beijing). "Dis... Read More

US Patent Issued to Sony Semiconductor Solutions on Aug. 11 for "Semiconductor package and method for manufacturing semiconductor package" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,740, issued on Aug. 11, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Semiconductor package and method for manufac... Read More

US Patent Issued to Sony Semiconductor Solutions on Aug. 11 for "Imaging element and semiconductor chip" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,741, issued on Aug. 11, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Imaging element and semiconductor chip" was ... Read More

US Patent Issued to HAMAMATSU PHOTONICS on Aug. 11 for "Solid-state imaging device" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,742, issued on Aug. 11, was assigned to HAMAMATSU PHOTONICS K.K. (Hamamatsu, Japan). "Solid-state imaging device" was invented by Makoto Ko... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Semiconductor image-sensing structure having electro-optical modulator and image sensor device having the same" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,743, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor image-sensing str... Read More

US Patent Issued to CANON on Aug. 11 for "Photoelectric conversion element and photoelectric conversion device" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,744, issued on Aug. 11, was assigned to CANON K.K. (Tokyo). "Photoelectric conversion element and photoelectric conversion device" was inve... Read More

US Patent Issued to Sony Semiconductor Solutions on Aug. 11 for "Photodetection device and electronic apparatus" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,745, issued on Aug. 11, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Photodetection device and electronic apparat... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Image sensor and method of fabricating the same" (South Korean Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,746, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Image sensor and method of fabricating the s... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Image sensor with epitaxial sealing layer for front-side deep trench isolation and manufacturing method thereof" (Taiwanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,747, issued on Aug. 11, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Image sensor with epitaxial sea... Read More

US Patent Issued to Sony Semiconductor Solutions on Aug. 11 for "Semiconductor device with blocks including units with a protection element and a bump connected to a main unit" (Japanese Inventor)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,748, issued on Aug. 11, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Semiconductor device with blocks including u... Read More

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US Patent Issued to BEIJING BOE DISPLAY TECHNOLOGY, BOE TECHNOLOGY GROUP on Aug. 11 for "Display panel, method of manufacturing the same and display device" (Chinese Inventors)

US Patent Issued to Sony Semiconductor Solutions on Aug. 11 for "Semiconductor package and method for manufacturing semiconductor package" (Japanese Inventors)

US Patent Issued to Sony Semiconductor Solutions on Aug. 11 for "Imaging element and semiconductor chip" (Japanese Inventors)

US Patent Issued to HAMAMATSU PHOTONICS on Aug. 11 for "Solid-state imaging device" (Japanese Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Semiconductor image-sensing structure having electro-optical modulator and image sensor device having the same" (Taiwanese Inventors)

US Patent Issued to CANON on Aug. 11 for "Photoelectric conversion element and photoelectric conversion device" (Japanese Inventors)

US Patent Issued to Sony Semiconductor Solutions on Aug. 11 for "Photodetection device and electronic apparatus" (Japanese Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Image sensor and method of fabricating the same" (South Korean Inventors)

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 11 for "Image sensor with epitaxial sealing layer for front-side deep trench isolation and manufacturing method thereof" (Taiwanese Inventors)

US Patent Issued to Sony Semiconductor Solutions on Aug. 11 for "Semiconductor device with blocks including units with a protection element and a bump connected to a main unit" (Japanese Inventor)