US Patent Issued to Sony Semiconductor Solutions on Aug. 11 for "Semiconductor package and method for manufacturing semiconductor package" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,740, issued on Aug. 11, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan).

"Semiconductor package and method for manufacturing semiconductor package" was invented by Shunsaku Hanaoka (Kumamoto, Japan), Takuya Nakamura (Kanagawa, Japan), Shumpei Aoki (Kanagawa, Japan), Yukihide Keigo (Kumamoto, Japan), Eiichirou Kishida (Kumamoto, Japan), Ayaka Seki (Kumamoto, Japan), Yuji Hara (Kumamoto, Japan), Seigi Ono (Kumamoto, Japan), Junki Komori (Kumamoto, Japan), Takayuki Tanaka (Kumamoto, Japan) and Tomohiko Baba (Kanagawa, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "Miniaturization is facilitated in a semiconductor package prov...