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US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Wafer-to-wafer bonding structure and image sensor including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,742, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Wafer-to-wafer bonding structure and image s... Read More


US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on June 23 for "Semiconductor apparatus, imaging apparatus, and manufacturing method of semiconductor apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,743, issued on June 23, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan). "Semiconductor apparatus, imaging apparatus, ... Read More


US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Image sensor chip including alignment mark and image sensor package including the same" (South Korean Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,744, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Image sensor chip including alignment mark a... Read More


US Patent Issued to STMicroelectronics (Crolles 2) on June 23 for "Image acquisition device" (French Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,745, issued on June 23, was assigned to STMicroelectronics (Crolles 2) SAS (Crolles, France). "Image acquisition device" was invented by La... Read More


US Patent Issued to SONY SEMICONDUCTOR SOLUTIONS on June 23 for "Solid-state imaging device, manufacturing method of solid-state imaging device, and electronic apparatus" (Japanese Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,746, issued on June 23, was assigned to SONY SEMICONDUCTOR SOLUTIONS Corp. (Kanagawa, Japan). "Solid-state imaging device, manufacturing me... Read More


US Patent Issued to Sony Semiconductor Solutions on June 23 for "Solid-state imaging device and electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,747, issued on June 23, was assigned to Sony Semiconductor Solutions Corp. (Kanagawa, Japan). "Solid-state imaging device and electronic ap... Read More


US Patent Issued to SIONYX on June 23 for "Photosensitive imaging devices and associated methods" (Oregon Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,748, issued on June 23, was assigned to SIONYX LLC (Beverly, Mass.). "Photosensitive imaging devices and associated methods" was invented b... Read More


US Patent Issued to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE on June 23 for "Thermal decomposition apparatus and thermal decomposition method applying the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,749, issued on June 23, was assigned to INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE (Hsinchu, Taiwan). "Thermal decomposition apparatus and th... Read More


US Patent Issued to SHANGRAO XINYUAN YUEDONG TECHNOLOGY DEVELOPMENT on June 23 for "Solar cell and solar cell panel including same" (South Korean Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,750, issued on June 23, was assigned to SHANGRAO XINYUAN YUEDONG TECHNOLOGY DEVELOPMENT Co. LTD. (Jiangxi Province, China). "Solar cell and... Read More


US Patent Issued to Nivarox-FAR on June 23 for "Transparent solar cell for an electronic device and method for manufacturing said solar cell" (Swiss Inventors)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,751, issued on June 23, was assigned to Nivarox-FAR S.A. (Le Locle, Switzerland). "Transparent solar cell for an electronic device and meth... Read More