US Patent Issued to SAMSUNG ELECTRONICS on June 23 for "Image sensor chip including alignment mark and image sensor package including the same" (South Korean Inventor)

ALEXANDRIA, Va., July 15 -- United States Patent no. 12,666,744, issued on June 23, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea).

"Image sensor chip including alignment mark and image sensor package including the same" was invented by Kyoungsoon Cho (Incheon, South Korea).

According to the abstract* released by the U.S. Patent & Trademark Office: "An image sensor chip includes a wiring layer. A semiconductor substrate is on the wiring layer and includes a photoelectric converter. A lattice structure is on the semiconductor substrate. An alignment mark layer is on the semiconductor substrate and is surrounded by the lattice structure in a plan view. Dummy color filters are on the semiconductor substrate and surround...