Exclusive

Publication

Byline

Location

US Patent Issued to NAN YA PLASTICS on June 30 for "Pressure-sensitive adhesive tape suitable for component cutting process" (Taiwanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,723, issued on June 30, was assigned to NAN YA PLASTICS Corp. (Taipei, Taiwan). "Pressure-sensitive adhesive tape suitable for component cu... Read More


US Patent Issued to tesa on June 30 for "Thermal-activated, peelable adhesive tape" (Chinese, German Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,724, issued on June 30, was assigned to tesa SE (Norderstedt, Germany). "Thermal-activated, peelable adhesive tape" was invented by Jianxin... Read More


US Patent Issued to SAMSUNG DISPLAY on June 30 for "Adhesive composition and display apparatus including the same" (South Korean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,725, issued on June 30, was assigned to SAMSUNG DISPLAY Co. LTD. (Gyeonggi-Do, South Korea). "Adhesive composition and display apparatus in... Read More


US Patent Issued to SAMSUNG ELECTRONICS on June 30 for "Adhesive composition and method of manufacturing a semiconductor device using the same" (South Korean Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,726, issued on June 30, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Adhesive composition and method of manufactu... Read More


US Patent Issued to FUJIFILM on June 30 for "Adhesive sheet and electronic component" (Japanese Inventor)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,727, issued on June 30, was assigned to FUJIFILM Corp. (Tokyo). "Adhesive sheet and electronic component" was invented by Tatsuo Mikami (Ka... Read More


US Patent Issued on June 30 for "Adhesive agent for semiconductors, and semiconductor device and method for manufacturing same" (Japanese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,728, issued on June 30. "Adhesive agent for semiconductors, and semiconductor device and method for manufacturing same" was invented by Tos... Read More


US Patent Issued to LUXCASE PRECISION TECHNOLOGY (YANCHENG) on June 30 for "Protective colloid with effective protection of attachment and method for using the same" (Chinese Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,729, issued on June 30, was assigned to LUXCASE PRECISION TECHNOLOGY (YANCHENG) Co. LTD. (Yancheng City, China). "Protective colloid with e... Read More


US Patent Issued to Henkel on June 30 for "Polyurethane adhesive composition for film lamination" (German Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,730, issued on June 30, was assigned to Henkel AG & Co. KGaA (Duesseldorf, Germany). "Polyurethane adhesive composition for film lamination... Read More


US Patent Issued to Green Ladder Technologies on June 30 for "Ice melt and traction enhancement compositions, and related methods" (Illinois Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,731, issued on June 30, was assigned to Green Ladder Technologies LLC (Batavia, Ill.). "Ice melt and traction enhancement compositions, and... Read More


US Patent Issued to Evonik Operations on June 30 for "Method of cooling an electrical equipment system by using a dielectric fluid composition having good heat dissipation over a wide temperature range" (German, Singaporean Inventors)

ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,732, issued on June 30, was assigned to Evonik Operations GmbH (Essen, Germany). "Method of cooling an electrical equipment system by using... Read More