ALEXANDRIA, Va., July 16 -- United States Patent no. 12,668,728, issued on June 30.
"Adhesive agent for semiconductors, and semiconductor device and method for manufacturing same" was invented by Toshiyasu Akiyoshi (Tokyo) and Ryuta Kawamata (Tokyo).
According to the abstract* released by the U.S. Patent & Trademark Office: "An adhesive for a semiconductor, the adhesive containing a thermoplastic resin, a thermosetting resin, a curing agent, and a flux compound having at least one carboxyl group, in which the flux compound has a structure in which an Alpha-position carbon of the carboxyl group is substituted by at least one electron-withdrawing group."
The patent was filed on Sept. 13, 2021, under Application No. 18/043,731.
*For furthe...