US Patent Issued to Semes on Aug. 11 for "Apparatus for treating substrate" (South Korean Inventors)

Posted On: 2026-08-12

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,915, issued on Aug. 11, was assigned to Semes Co. Ltd. (Chungcheongnam-do, South Korea). "Apparatus for treating substrate" was invented by... Read More

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Brush assembly and wafer cleaning device including the same" (South Korean Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,916, issued on Aug. 11, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Brush assembly and wafer cleaning device inc... Read More

US Patent Issued to SCREEN Holdings on Aug. 11 for "Substrate processing method and substrate processing device" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,917, issued on Aug. 11, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate processing method and substrate processing devi... Read More

US Patent Issued to KOKUSAI ELECTRIC on Aug. 11 for "Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,918, issued on Aug. 11, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Substrate processing apparatus, method of manufacturing semiconduc... Read More

US Patent Issued to Tokyo Electron on Aug. 11 for "Bonding apparatus and bonding method" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,919, issued on Aug. 11, was assigned to Tokyo Electron Ltd. (Tokyo). "Bonding apparatus and bonding method" was invented by Tokutarou Hayas... Read More

US Patent Issued to SCREEN Holdings on Aug. 11 for "Processing condition specifying method, substrate processing method, substrate product production method, computer program, storage medium, processing condition specifying device, and substrate processing apparatus" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,920, issued on Aug. 11, was assigned to SCREEN Holdings Co. Ltd. (Japan). "Processing condition specifying method, substrate processing met... Read More

US Patent Issued to Applied Materials on Aug. 11 for "Methods and assemblies for gas flow ratio control" (American, Indian Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,921, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Methods and assemblies for gas flow ratio control" w... Read More

US Patent Issued to Applied Materials on Aug. 11 for "Determining a substrate location threshold based on optical properties" (Texas Inventor)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,922, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Determining a substrate location threshold based on ... Read More

US Patent Issued to EBARA on Aug. 11 for "Substrate conveyance method, substrate processing device, and recording medium" (Japanese Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,923, issued on Aug. 11, was assigned to EBARA Corp. (Tokyo). "Substrate conveyance method, substrate processing device, and recording mediu... Read More

US Patent Issued to Applied Materials on Aug. 11 for "Systems and methods for detecting a substrate in a chamber of a substrate processing system" (California Inventors)

Posted On: 2026-08-12

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ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,924, issued on Aug. 11, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Systems and methods for detecting a substrate in a c... Read More

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US Patent Issued to Semes on Aug. 11 for "Apparatus for treating substrate" (South Korean Inventors)

US Patent Issued to SAMSUNG ELECTRONICS on Aug. 11 for "Brush assembly and wafer cleaning device including the same" (South Korean Inventors)

US Patent Issued to SCREEN Holdings on Aug. 11 for "Substrate processing method and substrate processing device" (Japanese Inventors)

US Patent Issued to KOKUSAI ELECTRIC on Aug. 11 for "Substrate processing apparatus, method of manufacturing semiconductor device, and recording medium" (Japanese Inventors)

US Patent Issued to Tokyo Electron on Aug. 11 for "Bonding apparatus and bonding method" (Japanese Inventors)

US Patent Issued to SCREEN Holdings on Aug. 11 for "Processing condition specifying method, substrate processing method, substrate product production method, computer program, storage medium, processing condition specifying device, and substrate processing apparatus" (Japanese Inventors)

US Patent Issued to Applied Materials on Aug. 11 for "Methods and assemblies for gas flow ratio control" (American, Indian Inventors)

US Patent Issued to Applied Materials on Aug. 11 for "Determining a substrate location threshold based on optical properties" (Texas Inventor)

US Patent Issued to EBARA on Aug. 11 for "Substrate conveyance method, substrate processing device, and recording medium" (Japanese Inventors)

US Patent Issued to Applied Materials on Aug. 11 for "Systems and methods for detecting a substrate in a chamber of a substrate processing system" (California Inventors)