US Patent Issued to SCREEN Holdings on Aug. 11 for "Substrate processing method and substrate processing device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 12 -- United States Patent no. 12,707,917, issued on Aug. 11, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan).

"Substrate processing method and substrate processing device" was invented by Masaki Inaba (Kyoto, Japan) and Eiji Umeda (Kyoto, Japan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate processing method processes a substrate having a first principal surface that has a first peripheral edge portion, a second principal surface that has a second peripheral edge portion, and an outer peripheral end that couples the first peripheral edge portion and the second peripheral edge portion. The method includes a protection film forming step of supplying a protection film ...