ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,148, issued on Aug. 25, was assigned to INTERNATIONAL BUSINESS MACHINES Corp. (Armonk, N.Y.). "Semiconductor device with power supply distr... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,149, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Nonvolatile memory device and system compris... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,150, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device with assisting layer and me... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,151, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device having insulating layer... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,152, issued on Aug. 25, was assigned to NANYA TECHNOLOGY Corp. (New Taipei City, Taiwan). "Semiconductor device and method for fabricating ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,153, issued on Aug. 25, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Topological semi-metal interconnects" was in... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,154, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure having ... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,155, issued on Aug. 25, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device" was invented by Jihyun... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,156, issued on Aug. 25, was assigned to SG MICRO CORP (Beijing). "Device module, manufacturing method therefor, and inductor-capacitor arra... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,157, issued on Aug. 25, was assigned to QUALCOMM Incorproated (San Diego). "Die interconnect structure with embedded inductor(s) including ... Read More