ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,076, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method for manufacturing semico... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,077, issued on Aug. 25, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Slurry recycling for chemical mecha... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,078, issued on Aug. 25, was assigned to Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V. (Munich). "Method for laser-ba... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,079, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,080, issued on Aug. 25, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Semiconductor cleaning using plasma-free precursors"... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,081, issued on Aug. 25, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING Co. LTD. (Hsinchu, Taiwan). "Semiconductor device and method" wa... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,082, issued on Aug. 25, was assigned to ASM IP Holding B.V. (Almere, Netherlands). "Gas injector assembly" was invented by Theodorus G.M. O... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,083, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and substrate processing method" was i... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,084, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing method and substrate processing apparatus" was i... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,085, issued on Aug. 25, was assigned to SCREEN Holdings Co. Ltd. (Kyoto, Japan). "Substrate treatment device and substrate treatment method... Read More