ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,765, issued on Nov. 3, was assigned to HANGZHOU SILAN MICROELECTRONICS Co. LTD. (Hangzhou, China). "Method for flip-flop unit" was invented ... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,766, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Verifying multi-cycle interconnect synthesis o... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,767, issued on Nov. 3, was assigned to The Board of Trustees of the Leland Stanford Junior University (Stanford, Calif.). "Generalized QED p... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,768, issued on Nov. 3, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Fault detection of circuit based on v... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,769, issued on Nov. 3, was assigned to Plexim GmbH (Zurich, Switzerland). "Method and apparatus for simulating an electrical circuit, digita... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,770, issued on Nov. 3, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Timing analysis of a digital integrated circui... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,771, issued on Nov. 3, was assigned to XILINX INC. (San Jose, Calif.). "Aligning multi-chip devices" was invented by Martin L. Voogel (Niwot... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,772, issued on Nov. 3, was assigned to Plexim GmbH (Zurich, Switzerland). "Method and apparatus for simulating an electrical circuit, digita... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,773, issued on Nov. 3, was assigned to Applied Materials Inc. (Santa Clara, Calif.). "Dose mapping using substrate curvature to compensate f... Read More
ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,783,774, issued on Nov. 3, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Bonded semiconductor device and m... Read More