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US Patent Issued to MELLANOX TECHNOLOGIES on Nov. 3 for "Liquid cooled network-interface controller (NIC) assembly" (Israeli Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,148, issued on Nov. 3, was assigned to MELLANOX TECHNOLOGIES LTD. (Yokneam, Israel). "Liquid cooled network-interface controller (NIC) assem... और पढ़ें


US Patent Issued to ALL BEST PRECISION TECHNOLOGY on Nov. 3 for "Loopback module" (Taiwanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,149, issued on Nov. 3, was assigned to ALL BEST PRECISION TECHNOLOGY Co. LTD. (Taoyuan City, Taiwan). "Loopback module" was invented by Have... और पढ़ें


US Patent Issued to BULL on Nov. 3 for "Electronic board equipped with a heat dissipation device and apparatus comprising such an electronic board" (French Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,150, issued on Nov. 3, was assigned to BULL SAS (Les Clayes-sous-Bois, France). "Electronic board equipped with a heat dissipation device an... और पढ़ें


US Patent Issued to Telefonaktiebolaget LM Ericsson on Nov. 3 for "Method of producing a PCB, as well as a PCB, and a circuit board" (Swedish Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,152, issued on Nov. 3, was assigned to Telefonaktiebolaget LM Ericsson (publ) (Stockholm). "Method of producing a PCB, as well as a PCB, and... और पढ़ें


US Patent Issued to Dell Products on Nov. 3 for "Conductive leak barriers to protect sensitive circuitry" (Texas Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,154, issued on Nov. 3, was assigned to Dell Products LP (Round Rock, Texas). "Conductive leak barriers to protect sensitive circuitry" was i... और पढ़ें


US Patent Issued to Murata Manufacturing on Nov. 3 for "Circuit module" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,156, issued on Nov. 3, was assigned to Murata Manufacturing Co. Ltd. (Kyoto, Japan). "Circuit module" was invented by Tsuyoshi Takakura (Kyo... और पढ़ें


US Patent Issued to Samsung Electro-Mechanics on Nov. 3 for "Circuit board" (South Korean Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,157, issued on Nov. 3, was assigned to Samsung Electro-Mechanics Co. Ltd. (Suwon-si, South Korea). "Circuit board" was invented by Ho-Jae Le... और पढ़ें


US Patent Issued to MEC ADDHEAT (KAIPING) on Nov. 3 for "Anti-break structure for setting buffer sheets at circuit board edges" (Chinese Inventor)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,158, issued on Nov. 3, was assigned to MEC ADDHEAT (KAIPING) Co. LTD. (Kaiping City, China). "Anti-break structure for setting buffer sheets... और पढ़ें


US Patent Issued to NGK ELECTRONICS DEVICES, NGK INSULATORS on Nov. 3 for "Ceramic wiring member" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,159, issued on Nov. 3, was assigned to NGK ELECTRONICS DEVICES INC. (Mine, Japan) and NGK INSULATORS Ltd. (Nagoya, Japan). "Ceramic wiring m... और पढ़ें


US Patent Issued to JOHNAN on Nov. 3 for "Circuit board" (Japanese Inventors)

ALEXANDRIA, Va., Nov. 3 -- United States Patent no. 12,787,160, issued on Nov. 3, was assigned to JOHNAN Corp. (Uji, Japan). "Circuit board" was invented by Yoshinari Matsuda (Uji, Japan), Kazuhiro K... और पढ़ें