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INTERNATIONAL PATENT: AGC INC., AGC株式会社 FILES APPLICATION FOR "METHOD FOR PRODUCING POLYESTER AND POLYMER"

GENEVA, April 14 -- AGC INC. (5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008405), AGC株式会社 (東京都千代田区&#20... Read More


INTERNATIONAL PATENT: NHK SPRING CO., LTD., 日本発條株式会社 FILES APPLICATION FOR "INSULATING RESIN COMPOSITION AND CIRCUIT BOARD"

GENEVA, April 14 -- NHK SPRING CO., LTD. (3-10, Fukuura, Kanazawa-ku, Yokohama-shi, Kanagawa2360004), 日本発條株式会社 (神奈川県... Read More


INTERNATIONAL PATENT: IDEMITSU KOSAN CO.,LTD., 出光興産株式会社 FILES APPLICATION FOR "DEUTERATED COMPOUND PRODUCTION METHOD"

GENEVA, April 14 -- IDEMITSU KOSAN CO.,LTD. (2-1, Otemachi 1-chome, Chiyoda-ku, Tokyo1008321), 出光興産株式会社 (東京都千&#20195... Read More


INTERNATIONAL PATENT: JVCKENWOOD CORPORATION, 株式会社JVCケンウッド FILES APPLICATION FOR "FEATURE MAP ENCODING DEVICE, FEATURE MAP ENCODING METHOD, FEATURE MAP DECODING DEVICE AND FEATURE MAP DECODING METHOD"

GENEVA, April 14 -- JVCKENWOOD CORPORATION (3-12, Moriyacho, Kanagawa-ku, Yokohama-shi Kanagawa2210022), 株式会社JVCケンウッ&#12489... Read More


INTERNATIONAL PATENT: YUTAKA ELECTRONICS INDUSTRY CO., LTD., 株式会社豊電子工業 FILES APPLICATION FOR "MACHINING HEAD, MACHINING HEAD MODULE AND MULTI-AXIS ROBOT"

GENEVA, April 14 -- YUTAKA ELECTRONICS INDUSTRY CO., LTD. (5-12-9, Hitotsugi-cho, Kariya-shi, Aichi4488533), 株式会社豊電子工業 (愛知&... Read More


INTERNATIONAL PATENT: YUTAKA ELECTRONICS INDUSTRY CO., LTD., 株式会社豊電子工業 FILES APPLICATION FOR "MACHINING HEAD MODULE, MULTI-AXIS ROBOT AND METHOD FOR CONTROLLING MACHINING HEAD"

GENEVA, April 14 -- YUTAKA ELECTRONICS INDUSTRY CO., LTD. (5-12-9, Hitotsugi-cho, Kariya-shi, Aichi4488533), 株式会社豊電子工業 (愛知&... Read More


INTERNATIONAL PATENT: NTT DOCOMO, INC., 株式会社NTTドコモ FILES APPLICATION FOR "TERMINAL AND COMMUNICATION METHOD"

GENEVA, April 14 -- NTT DOCOMO, INC. (11-1, Nagatacho 2-chome, Chiyoda-ku, Tokyo1006150), 株式会社NTTドコモ (東京都&#21... Read More


INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "METHOD FOR MANUFACTURING SUBSTRATE WITH ELECTROCONDUCTIVE PILLARS AND METAL PASTE FOR FORMING ELECTROCONDUCTIVE PILLARS"

GENEVA, April 14 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都&#2... Read More


INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "SUBSTRATE PROVIDED WITH CONDUCTIVE PILLAR AND METHOD FOR MANUFACTURING SAID SUBSTRATE"

GENEVA, April 14 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都&#2... Read More


INTERNATIONAL PATENT: AGC INC., AGC株式会社 FILES APPLICATION FOR "LAMINATED FILM"

GENEVA, April 14 -- AGC INC. (5-1, Marunouchi 1-chome, Chiyoda-ku, Tokyo1008405), AGC株式会社 (東京都千代田区&#20... Read More