INTERNATIONAL PATENT: RESONAC CORPORATION, 株式会社レゾナック FILES APPLICATION FOR "SUBSTRATE PROVIDED WITH CONDUCTIVE PILLAR AND METHOD FOR MANUFACTURING SAID SUBSTRATE"

GENEVA, April 14 -- RESONAC CORPORATION (9-1, Higashi-Shimbashi 1-chome, Minato-ku, Tokyo1057325), 株式会社レゾナック (東京都港区東新橋一丁目９番１号) filed a patent application (PCT/JP2025/034490) for "SUBSTRATE PROVIDED WITH CONDUCTIVE PILLAR AND METHOD FOR MANUFACTURING SAID SUBSTRATE" on Sep 29, 2025. With publication no. WO/2026/075077, the details related to the patent application was published on Apr 09, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inve...