US Patent Issued to Samkee Ev on July 21 for "Flat flexible printed circuit" (South Korean Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,131, issued on July 21, was assigned to Samkee Ev Co. Ltd. (Seosan-si, South Korea). "Flat flexible printed circuit" was invented by Seung ... और पढ़ें

US Patent Issued to Solidigm on July 21 for "Releasable spacer, solid-state drive assembly, and method to manufacture the same" (Canadian, American, Chinese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,132, issued on July 21, was assigned to Solidigm Inc. (Rancho Cordova, Calif.). "Releasable spacer, solid-state drive assembly, and method ... और पढ़ें

US Patent Issued to Hewlett Packard Enterprise Development on July 21 for "System board with staggered power connectors and power adapters facilitating compatability with different chassis" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,133, issued on July 21, was assigned to Hewlett Packard Enterprise Development LP (Spring, Texas). "System board with staggered power conne... और पढ़ें

US Patent Issued to AMD Design on July 21 for "Printed circuit board thumbscrew locking reinforcement structure" (New Jersey Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,134, issued on July 21, was assigned to AMD Design LLC (Wilmington, Del.). "Printed circuit board thumbscrew locking reinforcement structur... और पढ़ें

US Patent Issued to Dell Products on July 21 for "Systems and methods for adding ergonomic handling assembly to an information handling resource module" (Texas, South Carolina Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,135, issued on July 21, was assigned to Dell Products LP (Round Rock, Texas). "Systems and methods for adding ergonomic handling assembly t... और पढ़ें

US Patent Issued to Intel on July 21 for "Embedded passives with cavity sidewall interconnect in glass core architecture" (Arizona Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,136, issued on July 21, was assigned to Intel Corp. (Santa Clara, Calif.). "Embedded passives with cavity sidewall interconnect in glass co... और पढ़ें

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on July 21 for "Printed circuit board" (South Korean Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,137, issued on July 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by... और पढ़ें

US Patent Issued to KOLLMORGEN on July 21 for "Solder joint inspection features" (Virginia Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,138, issued on July 21, was assigned to KOLLMORGEN Corp. (Radford, Va.). "Solder joint inspection features" was invented by Jeffery Todd Br... और पढ़ें

US Patent Issued on July 21 for "Method for manufacturing a printed circuit board with an embedded shield" (Taiwanese Inventors)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,139, issued on July 21. "Method for manufacturing a printed circuit board with an embedded shield" was invented by Kuo-Hao Pao (Hsinchu Cit... और पढ़ें

US Patent Issued to SAMSUNG ELECTRO-MECHANICS on July 21 for "Circuit board and method for manufacturing the same" (South Korean Inventor)

ALEXANDRIA, Va., July 21 -- United States Patent no. 12,690,140, issued on July 21, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Circuit board and method for manufactu... और पढ़ें

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