US Patent Issued to ROHM on June 16 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,695, issued on June 16, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Kengo Ohmori (Kyoto, Japan). ... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Integrated circuit packages and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,696, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Integrated circuit packages and met... Read More

US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Semiconductor structure with vertical connection structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,697, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor structure with vertic... Read More

US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on June 16 for "Bond head with elastic material around perimeter to improve bonding quality" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,698, issued on June 16, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Bond head with elastic material... Read More

US Patent Issued to Huawei Digital Power Technologies on June 16 for "Package structure of bidirectional switch, semiconductor device, and power converter" (Chinese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,699, issued on June 16, was assigned to Huawei Digital Power Technologies Co. Ltd. (Shenzhen, China). "Package structure of bidirectional s... Read More

US Patent Issued to Micron Technology on June 16 for "Semiconductor devices having aligned front-end interface contacts and back-end interface contacts, and associated systems and methods" (Singaporean, American Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,700, issued on June 16, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor devices having aligned front-end interface co... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Display module and display apparatus having the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,701, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Display module and display apparatus having ... Read More

US Patent Issued to SAMSUNG ELECTRONICS on June 16 for "Semiconductor package and method of fabricating the same" (South Korean Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,702, issued on June 16, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor package and method of fabricat... Read More

US Patent Issued to Advanced Micro Devices on June 16 for "3D layout and organization for enhancement of modern memory systems" (California, Texas Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,703, issued on June 16, was assigned to Advanced Micro Devices Inc. (Santa Clara, Calif.). "3D layout and organization for enhancement of m... Read More

US Patent Issued to Advanced Semiconductor Engineering on June 16 for "Electronic device and chiplet module" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,704, issued on June 16, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic device and chiplet module"... Read More

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