US Patent Issued to Taiwan Semiconductor Manufacturing on June 16 for "Semiconductor structure with vertical connection structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., June 16 -- United States Patent no. 12,660,697, issued on June 16, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan).

"Semiconductor structure with vertical connection structure and manufacturing method thereof" was invented by Chuei-Tang Wang (Taichung City, Taiwan), Tso-Jung Chang (Taoyuan City, Taiwan), Jeng-Shien Hsieh (Kaohsiung, Taiwan), Shih-Ping Lin (Taichung City, Taiwan), Chih-Peng Lin (Hsinchu County, Taiwan), Chieh-Yen Chen (Taipei City, Taiwan) and Chen-Hua Yu (Hsinchu City, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor structure includes a first tier, a redistribution circuit structure, and a second tier. The first tier includ...