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US Patent Issued to ROHM on July 14 for "Semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,865, issued on July 14, was assigned to ROHM Co. LTD. (Kyoto, Japan). "Semiconductor device" was invented by Yuji Matsumoto (Kyoto, Japan).... Read More


US Patent Issued to GLOBALFOUNDRIES U.S. on July 14 for "Field plated bidirectional HEMT structure" (Vermont, New York, Texas Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,866, issued on July 14, was assigned to GLOBALFOUNDRIES U.S. Inc (Malta, N.Y.). "Field plated bidirectional HEMT structure" was invented by... Read More


US Patent Issued to ENKRIS SEMICONDUCTOR on July 14 for "Composite substrate and method for manufacturing the same, and semiconductor device structure" (Chinese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,867, issued on July 14, was assigned to ENKRIS SEMICONDUCTOR INC. (Suzhou, China). "Composite substrate and method for manufacturing the sa... Read More


US Patent Issued to Samsung Display on July 14 for "Display device and method of manufacturing the same" (South Korean Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,868, issued on July 14, was assigned to Samsung Display Co. Ltd. (Yongin-si, South Korea). "Display device and method of manufacturing the ... Read More


US Patent Issued to International Business Machines on July 14 for "Contact placeholder formation for different device types" (New York Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,869, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Contact placeholder formation for different ... Read More


US Patent Issued to Chengdu BOE Optoelectronics Technology, BOE Technology Group on July 14 for "Display panel having a bonding region" (Chinese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,870, issued on July 14, was assigned to Chengdu BOE Optoelectronics Technology Co. Ltd. (Chengdu, China) and BOE Technology Group Co. Ltd. (... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on July 14 for "Shielded deep trench capacitor structure and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,871, issued on July 14, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Shielded deep trench capacitor stru... Read More


US Patent Issued to Semiconductor Energy Laboratory on July 14 for "Semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,872, issued on July 14, was assigned to Semiconductor Energy Laboratory Co. Ltd. (Atsugi, Japan). "Semiconductor device" was invented by Ta... Read More


US Patent Issued to International Business Machines on July 14 for "Self-aligned backside interconnect structures" (New York, New Hampshire, Vermont Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,873, issued on July 14, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Self-aligned backside interconnect structure... Read More


US Patent Issued to QUALCOMM on July 14 for "Logic circuits including circuits of different heights and related method of fabrication" (American, Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,874, issued on July 14, was assigned to QUALCOMM Inc. (San Diego). "Logic circuits including circuits of different heights and related meth... Read More