ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,019, issued on Aug. 4, was assigned to SAMSUNG ELECTRONICS Co. Ltd. (Suwon-si, South Korea). "Semiconductor package" was invented by Kanggyu... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,020, issued on Aug. 4, was assigned to MITSUI HIGH-TEC INC. (Fukuoka, Japan). "Metal component including phosphorous-containing nickel layer... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,021, issued on Aug. 4, was assigned to TEXAS INSTRUMENTS Inc. (Dallas). "Substrate-on-die package architecture" was invented by Rajen Muruga... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,022, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Package structure and method of formi... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,023, issued on Aug. 4, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate" was invented by Toshiki Furutani (Ibi-gun, Japan) ... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,024, issued on Aug. 4, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board" was invented by Se Woong Na (Seoul, South K... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,025, issued on Aug. 4, was assigned to The Florida International University Board of Trustees (Miami). "Scalable electronics manufacturing w... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,026, issued on Aug. 4, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Semiconductor package" was invented by Hyun Sun Lee (Seoul... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,027, issued on Aug. 4, was assigned to Advanced Semiconductor Engineering Inc. (Kaohsiung, Taiwan). "Electronic device" was invented by Yung... और पढ़ें
ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,028, issued on Aug. 4, was assigned to Apple Inc. (Cupertino, Calif.). "Semiconductor package with local interconnect and chiplet integratio... और पढ़ें