ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,702,026, issued on Aug. 4, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea).
"Semiconductor package" was invented by Hyun Sun Lee (Seoul, South Korea), Dae Sung Moon (Seoul, South Korea) and Dong Hun Joung (Seoul, South Korea).
According to the abstract* released by the U.S. Patent & Trademark Office: "A semiconductor package according to an embodiment includes a first insulating layer; and a first through electrode part passing through the first insulating layer and having a shape elongated in a first direction; wherein the first through electrode part includes a plurality of first through electrodes spaced apart from each other in a second direction perpendicular to the firs...