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US Patent Issued to Mitsubishi Electric on Aug. 4 for "Inspection device, inspection method of semiconductor substrate, manufacturing method of semiconductor substrate, and manufacturing method of semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,968, issued on Aug. 4, was assigned to Mitsubishi Electric Corp. (Tokyo). "Inspection device, inspection method of semiconductor substrate, ... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "Simultaneous multi-bandwidth optical inspection of semiconductor devices" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,970, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Simultaneous multi-bandwidth opti... Read More


US Patent Issued to MEDIATEK SINGAPORE on Aug. 4 for "Semiconductor structure" (Singaporean Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,971, issued on Aug. 4, was assigned to MEDIATEK SINGAPORE PTE. LTD. (Singapore). "Semiconductor structure" was invented by Lian Duan (Singap... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "Semiconductor structure and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,972, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Semiconductor structure and manuf... Read More


US Patent Issued to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES on Aug. 4 for "Strong base-assisted direct bonding method" (French Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,973, issued on Aug. 4, was assigned to COMMISSARIAT A L'ENERGIE ATOMIQUE ET AUX ENERGIES ALTERNATIVES (Grenoble, France). "Strong base-assis... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "Methods for isolation process control and structures thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,974, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Methods for isolation process con... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Mitigating pattern collapse" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,975, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsin-Chu, Taiwan). "Mitigating pattern collapse" was inv... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on Aug. 4 for "Etch profile control of interconnect structures" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,976, issued on Aug. 4, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd.. "Etch profile control of interconnect structures" was in... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "Method for forming a contact plug with improved contact metal sealing" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,977, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method for forming a contact plug... Read More


US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 4 for "Doping free connection structures and methods" (Taiwanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,978, issued on Aug. 4, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Doping free connection structures... Read More