US Patent Issued to Mitsubishi Electric on Aug. 4 for "Inspection device, inspection method of semiconductor substrate, manufacturing method of semiconductor substrate, and manufacturing method of semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., Aug. 5 -- United States Patent no. 12,701,968, issued on Aug. 4, was assigned to Mitsubishi Electric Corp. (Tokyo).

"Inspection device, inspection method of semiconductor substrate, manufacturing method of semiconductor substrate, and manufacturing method of semiconductor device" was invented by Shunichi Watabe (Tokyo) and Tamio Matsumura (Tokyo).

According to the abstract* released by the U.S. Patent & Trademark Office: "An inspection device is an inspection device that inspects a semiconductor substrate. The inspection device includes a stage, a first ring, and a second ring. A first recess is provided on an upper surface of the stage. The first recess has a ring shape in plan view. The first ring is elastic. The first ...