ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,898, issued on Aug. 18, was assigned to Micron Technology Inc. (Boise, Idaho). "Semiconductor device assemblies with coplanar interconnect ... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,899, issued on Aug. 18, was assigned to Yangtze Memory Technologies Co. Ltd. (Wuhan, China). "Semiconductor device and fabrication method t... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,900, issued on Aug. 18, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Fly-over metal jumper connection" was invent... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,901, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor devices and data storage syste... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,902, issued on Aug. 18, was assigned to INTEL NDTM US LLC (Santa Clara, Calif.). "Engineered dielectric profile for high aspect-ratio 3D NA... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,903, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Method of manufacturing semicon... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,904, issued on Aug. 18, was assigned to SAMSUNG ELECTRONICS Co. LTD. (Suwon-si, South Korea). "Semiconductor device and electronic system i... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,905, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Interconnect layer and method f... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,906, issued on Aug. 18, was assigned to Skyworks Solutions Inc. (Irvine, Calif.). "Multilayer capacitors with interdigitated fingers" was i... Read More
ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,907, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan). "Back-end-of-line passive device... Read More