US Patent Issued to TAIWAN SEMICONDUCTOR MANUFACTURING on Aug. 18 for "Method of manufacturing semiconductor structure and semiconductor structure thereof" (Taiwanese Inventor)

ALEXANDRIA, Va., Aug. 18 -- United States Patent no. 12,713,903, issued on Aug. 18, was assigned to TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY LTD. (Hsinchu, Taiwan).

"Method of manufacturing semiconductor structure and semiconductor structure thereof" was invented by Szu-Ling Liu (Hsinchu, Taiwan).

According to the abstract* released by the U.S. Patent & Trademark Office: "A substrate is provided, wherein the substrate includes a device layer, and a logo region is defined in a peripheral region of the substrate. An interconnect structure is formed over the device layer. A first conductive feature and at least one second conductive feature are formed in the interconnect structure, wherein the first conductive feature is recognizable as a ...