Exclusive

Publication

Byline

Location

US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Interfacial dual passivation layer for a ferroelectric device and methods of forming the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,382, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Interfacial dual passivation layer fo... Read More


US Patent Issued to Intel on May 12 for "Transistors having stacked 2D material channel layers and heterogeneous 2D material contacts layers epitaxial to the 2D material channel layers" (Oregon Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,383, issued on May 12, was assigned to Intel Corp. (Santa Clara, Calif.). "Transistors having stacked 2D material channel layers and heterog... Read More


US Patent Issued to QUALCOMM on May 12 for "Enhanced-shaped extension region(s) for gate-all-around (GAA) field effect transistor (FET) device, and related fabrication methods" (California, North Carolina Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,384, issued on May 12, was assigned to QUALCOMM Inc. (San Diego). "Enhanced-shaped extension region(s) for gate-all-around (GAA) field effec... Read More


US Patent Issued to Taiwan Semiconductor Manufacturing on May 12 for "Semiconductor device and methods of formation" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,385, issued on May 12, was assigned to Taiwan Semiconductor Manufacturing Co. Ltd. (Hsinchu, Taiwan). "Semiconductor device and methods of f... Read More


US Patent Issued to FUJI ELECTRIC on May 12 for "Semiconductor device and manufacturing method of semiconductor device" (Japanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,386, issued on May 12, was assigned to FUJI ELECTRIC Co. LTD. (Kanagawa, Japan). "Semiconductor device and manufacturing method of semicondu... Read More


US Patent Issued to UNITED MICROELECTRONICS on May 12 for "Semiconductor device and method for fabricating the same" (Taiwanese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,387, issued on May 12, was assigned to UNITED MICROELECTRONICS CORP. (Hsin-Chu City, Taiwan). "Semiconductor device and method for fabricati... Read More


US Patent Issued to SiCrystal on May 12 for "Monocrystalline SiC substrates having an asymmetrical geometry and method of producing same" (Japanese, German Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,388, issued on May 12, was assigned to SiCrystal GmbH (Nuremberg, Germany). "Monocrystalline SiC substrates having an asymmetrical geometry ... Read More


US Patent Issued to International Business Machines on May 12 for "Nanosheet FET with controlled overlay mark" (New York Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,389, issued on May 12, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Nanosheet FET with controlled overlay mark" wa... Read More


US Patent Issued to International Business Machines on May 12 for "Nanosheet stacks with dielectric isolation layers" (New York Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,390, issued on May 12, was assigned to International Business Machines Corp. (Armonk, N.Y.). "Nanosheet stacks with dielectric isolation lay... Read More


US Patent Issued to INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES on May 12 for "Method for manufacturing semiconductor and semiconductor" (Chinese Inventors)

ALEXANDRIA, Va., May 12 -- United States Patent no. 12,628,391, issued on May 12, was assigned to INSTITUTE OF MICROELECTRONICS, CHINESE ACADEMY OF SCIENCES (Beijing). "Method for manufacturing semic... Read More