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US Patent Issued to Honeywell Federal Manufacturing & Technologies on July 14 for "Transparent package for use with printed circuit boards" (Missouri Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,689, issued on July 14, was assigned to Honeywell Federal Manufacturing & Technologies LLC (Kansas City, Mo.). "Transparent package for use... और पढ़ें


US Patent Issued to PANELSEMI on July 14 for "Electronic device" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,690, issued on July 14, was assigned to PANELSEMI Corp. (New Taipei City, Taiwan). "Electronic device" was invented by Chin-Tang Li (New Ta... और पढ़ें


US Patent Issued to VueReal on July 14 for "Selective transfer of micro devices" (Canadian Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,691, issued on July 14, was assigned to VueReal Inc. (Waterloo, Canada). "Selective transfer of micro devices" was invented by Gholamreza C... और पढ़ें


US Patent Issued to FANUC on July 14 for "Printed circuit board and dynamic brake circuit comprising same" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,692, issued on July 14, was assigned to FANUC Corp. (Yamanashi, Japan). "Printed circuit board and dynamic brake circuit comprising same" w... और पढ़ें


US Patent Issued to SEIKO EPSON on July 14 for "Sensor module" (Japanese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,693, issued on July 14, was assigned to SEIKO EPSON Corp. (Japan). "Sensor module" was invented by Hitoshi Ueno (Shiojiri, Japan). Accordi... और पढ़ें


US Patent Issued to Industrial Technology Research Institute on July 14 for "Package structure" (Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,694, issued on July 14, was assigned to Industrial Technology Research Institute (Hsinchu, Taiwan). "Package structure" was invented by Yu-... और पढ़ें


US Patent Issued to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO), AVARY HOLDING (SHENZHEN), GARUDA TECHNOLOGY on July 14 for "Flexible circuit board and method of fabricating the same" (Chinese Inventor)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,695, issued on July 14, was assigned to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co. LTD. (Hebei Province, China), AVARY HOLDING (SHE... और पढ़ें


US Patent Issued to Apple on July 14 for "Transfer molding systems for semiconductor device packaging" (California, Arizona Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,696, issued on July 14, was assigned to Apple Inc. (Cupertino, Calif.). "Transfer molding systems for semiconductor device packaging" was i... और पढ़ें


US Patent Issued to FUJIKURA PRINTED CIRCUITS on July 14 for "Method for manufacturing wiring board" (Japanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,697, issued on July 14, was assigned to FUJIKURA PRINTED CIRCUITS LTD. (Tokyo). "Method for manufacturing wiring board" was invented by Dai... और पढ़ें


US Patent Issued to QING DING PRECISION ELECTRONICS (HUAIAN), Avary Holding (Shenzhen) Co. Ltd. on July 14 for "Method for manufacturing a multilayer circuit board" (Chinese, Taiwanese Inventors)

ALEXANDRIA, Va., July 14 -- United States Patent no. 12,684,698, issued on July 14, was assigned to QING DING PRECISION ELECTRONICS (HUAIAN) Co. LTD (Huai an, China) and Avary Holding (Shenzhen) Co. L... और पढ़ें