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US Patent Issued to MURATA MANUFACTURING on July 28 for "High frequency module and communication device" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,379, issued on July 28, was assigned to MURATA MANUFACTURING Co. LTD. (Nagaokakyo, Japan). "High frequency module and communication device"... Read More


US Patent Issued to Sumitomo Electric Device Innovations on July 28 for "Matching circuit board and semiconductor device" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,380, issued on July 28, was assigned to Sumitomo Electric Device Innovations Inc. (Yokohama, Japan). "Matching circuit board and semiconduc... Read More


US Patent Issued to Wiliot on July 28 for "Electrostatic discharge collector" (Israeli Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,381, issued on July 28, was assigned to Wiliot Ltd. (Caesarea, Israel). "Electrostatic discharge collector" was invented by Alon Yehezkely ... Read More


US Patent Issued to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY, BOE TECHNOLOGY GROUP on July 28 for "Flexible circuit board and display module" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,382, issued on July 28, was assigned to CHENGDU BOE OPTOELECTRONICS TECHNOLOGY Co. LTD. (Chengdu, China) and BOE TECHNOLOGY GROUP Co. LTD. (... Read More


US Patent Issued to CANON on July 28 for "Flexible wiring board, manufacturing method, electronic module, electronic unit, and electronic apparatus" (Japanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,383, issued on July 28, was assigned to CANON K.K. (Tokyo). "Flexible wiring board, manufacturing method, electronic module, electronic uni... Read More


US Patent Issued to LG INNOTEK on July 28 for "Circuit board" (South Korean Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,384, issued on July 28, was assigned to LG INNOTEK Co. LTD. (Seoul, South Korea). "Circuit board" was invented by Dong Keon Lee (Seoul, Sou... Read More


US Patent Issued to TOPPAN HOLDINGS on July 28 for "Wiring board and manufacturing method therefor" (Japanese Inventor)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,385, issued on July 28, was assigned to TOPPAN HOLDINGS INC. (Tokyo). "Wiring board and manufacturing method therefor" was invented by Tomo... Read More


US Patent Issued to TAIWAN UNION TECHNOLOGY on July 28 for "Copper clad laminate and uses of the same" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,386, issued on July 28, was assigned to TAIWAN UNION TECHNOLOGY Corp. (Zhubei City, Taiwan). "Copper clad laminate and uses of the same" wa... Read More


US Patent Issued to SAN FANG CHEMICAL INDUSTRY on July 28 for "Conductive film and manufacturing method thereof" (Taiwanese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,387, issued on July 28, was assigned to SAN FANG CHEMICAL INDUSTRY Co. LTD. (Kaohsiung City, Taiwan). "Conductive film and manufacturing me... Read More


US Patent Issued to Chongqing BOE Electronic Technology, BOE Technology Group on July 28 for "Printed circuit board, maintenance method therefor, and display apparatus" (Chinese Inventors)

ALEXANDRIA, Va., July 28 -- United States Patent no. 12,696,388, issued on July 28, was assigned to Chongqing BOE Electronic Technology Co. Ltd. (Chongqing, China) and BOE Technology Group Co. Ltd. (B... Read More